Dream Chip Technologies Contributes ISP and Safety Island IP to CHASSIS Automotive Chiplet Programme
Dream Chip Technologies, part of the Tessolve group, announced on June 15, 2026 that it is contributing automotive-certified image signal processor (ISP) and Safety Island IP to the CHASSIS Automotive Base Die, a chiplet developed under the European Chips Joint Undertaking programme.
CHASSIS (Chiplet-based Hardware Architectures for Software-Defined Vehicles) is a three-year initiative backed by BMW, imec, and Bosch that aims to build an open, scalable chiplet ecosystem manufactured on TSMC's N5A node, with the Automotive Base Die serving as the central communication and integration hub for next-generation automotive system-on-chip infrastructure.
CHASSIS (Chiplet-based Hardware Architectures for Software-Defined Vehicles) is a three-year initiative backed by BMW, imec, and Bosch that aims to build an open, scalable chiplet ecosystem manufactured on TSMC's N5A node, with the Automotive Base Die serving as the central communication and integration hub for next-generation automotive system-on-chip infrastructure.